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Electromigration Reliability and Failure Mechanisms in Novel 3D Cu Stagger-via Interconnects for Advanced High-Density Fan-Out Packaging.

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Title: Electromigration Reliability and Failure Mechanisms in Novel 3D Cu Stagger-via Interconnects for Advanced High-Density Fan-Out Packaging.
Authors: Shao, Kuan-Ju1, Chiu, Meng-Chun2, Hu, Jui-Yi2, Liang, Chien-Lung2, clliang@mail.ntust.edu.tw, Tsai, Min-Yan3, Lin, Yung-Sheng3, Wang, Chen-Chao3, Hung, Chih-Pin3, Lin, Kwang-Lung1, matkllin@mail.ncku.edu.tw
Source: JOM: The Journal of The Minerals, Metals & Materials Society (TMS); Jun2026, Vol. 78 Issue 6, p5188-5206, 19p
Database: Applied Science & Technology Source
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  Availability: 0
Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 193654175
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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Items – Name: Title
  Label: Title
  Group: Ti
  Data: Electromigration Reliability and Failure Mechanisms in Novel 3D Cu Stagger-via Interconnects for Advanced High-Density Fan-Out Packaging.
– Name: Author
  Label: Authors
  Group: Au
  Data: <searchLink fieldCode="AU" term="%22Shao%2C+Kuan-Ju%22">Shao, Kuan-Ju</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Chiu%2C+Meng-Chun%22">Chiu, Meng-Chun</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Hu%2C+Jui-Yi%22">Hu, Jui-Yi</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Liang%2C+Chien-Lung%22">Liang, Chien-Lung</searchLink><relatesTo>2</relatesTo>, <i>clliang@mail.ntust.edu.tw</i><br /><searchLink fieldCode="AU" term="%22Tsai%2C+Min-Yan%22">Tsai, Min-Yan</searchLink><relatesTo>3</relatesTo><br /><searchLink fieldCode="AU" term="%22Lin%2C+Yung-Sheng%22">Lin, Yung-Sheng</searchLink><relatesTo>3</relatesTo><br /><searchLink fieldCode="AU" term="%22Wang%2C+Chen-Chao%22">Wang, Chen-Chao</searchLink><relatesTo>3</relatesTo><br /><searchLink fieldCode="AU" term="%22Hung%2C+Chih-Pin%22">Hung, Chih-Pin</searchLink><relatesTo>3</relatesTo><br /><searchLink fieldCode="AU" term="%22Lin%2C+Kwang-Lung%22">Lin, Kwang-Lung</searchLink><relatesTo>1</relatesTo>, <i>matkllin@mail.ncku.edu.tw</i>
– Name: TitleSource
  Label: Source
  Group: Src
  Data: <searchLink fieldCode="JN" term="%22JOM%3A+The+Journal+of+The+Minerals%2C+Metals+%26+Materials+Society+%28TMS%29%22">JOM: The Journal of The Minerals, Metals & Materials Society (TMS)</searchLink>; Jun2026, Vol. 78 Issue 6, p5188-5206, 19p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=193654175
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1007/s11837-025-08069-5
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 19
        StartPage: 5188
    Titles:
      – TitleFull: Electromigration Reliability and Failure Mechanisms in Novel 3D Cu Stagger-via Interconnects for Advanced High-Density Fan-Out Packaging.
        Type: main
  BibRelationships:
    HasContributorRelationships:
      – PersonEntity:
          Name:
            NameFull: Shao, Kuan-Ju
      – PersonEntity:
          Name:
            NameFull: Chiu, Meng-Chun
      – PersonEntity:
          Name:
            NameFull: Hu, Jui-Yi
      – PersonEntity:
          Name:
            NameFull: Liang, Chien-Lung
      – PersonEntity:
          Name:
            NameFull: Tsai, Min-Yan
      – PersonEntity:
          Name:
            NameFull: Lin, Yung-Sheng
      – PersonEntity:
          Name:
            NameFull: Wang, Chen-Chao
      – PersonEntity:
          Name:
            NameFull: Hung, Chih-Pin
      – PersonEntity:
          Name:
            NameFull: Lin, Kwang-Lung
    IsPartOfRelationships:
      – BibEntity:
          Dates:
            – D: 01
              M: 06
              Text: Jun2026
              Type: published
              Y: 2026
          Identifiers:
            – Type: issn-print
              Value: 10474838
          Numbering:
            – Type: volume
              Value: 78
            – Type: issue
              Value: 6
          Titles:
            – TitleFull: JOM: The Journal of The Minerals, Metals & Materials Society (TMS)
              Type: main
ResultId 1