Microstructural Evolution, Mechanical Properties, and Thermal Reliability of Bi- and Ni-Doped Sn-Ag-Based Lead-Free Solder Alloys. - Lin, Wei-Ting; Hsu, Chia-Jung; Chang, Po-Kai; Li, Kelvin; Lin, Kuo-Shu; Wang, Chang-Meng; Wu, Albert T. (JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2026)