Interfacial Reactions Between Ni-Electroplated Cu- 2.35 wt%Fe Alloy (C194) and Molten Sn Solder. - Chou, Jing-Ting; Lee, Hao-Wei; Lin, Yi-Pin; Cheng, Yu-Jhen; Yen, Yee-Wen (JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2026)