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Numerical Investigation of Nanofluid-filled Microchannel Heat Sinks for Improved Heat Transfer of High-power Electronic Devices.

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Title: Numerical Investigation of Nanofluid-filled Microchannel Heat Sinks for Improved Heat Transfer of High-power Electronic Devices.
Authors: Saadouni, I.1, ibrahim.saadouni@etu.uae.ac.ma, El Mrimar, O.1, Samoudi, B.1
Source: Journal of Applied Fluid Mechanics; Jun2026, Vol. 19 Issue 6, p1349-1364, 16p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 193699863
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PubType: Academic Journal
PubTypeId: academicJournal
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  Data: Numerical Investigation of Nanofluid-filled Microchannel Heat Sinks for Improved Heat Transfer of High-power Electronic Devices.
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RecordInfo BibRecord:
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      – Type: doi
        Value: 10.47176/jafm.19.6.4133
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      – Code: eng
        Text: English
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        PageCount: 16
        StartPage: 1349
    Titles:
      – TitleFull: Numerical Investigation of Nanofluid-filled Microchannel Heat Sinks for Improved Heat Transfer of High-power Electronic Devices.
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            NameFull: Saadouni, I.
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            NameFull: El Mrimar, O.
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            – D: 01
              M: 06
              Text: Jun2026
              Type: published
              Y: 2026
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              Value: 19
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              Value: 6
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