Tripathi, N., Setia, P., Sawalkar, S., Mondal, K., & Shekhar, S. (2026). Novel Asymmetric CCRP Die Geometry for Optimized Microstructure and Outstanding Failure Tolerance. Journal of Materials Engineering & Performance, 35(18), 18384. https://doi.org/10.1007/s11665-025-12942-4
Chicago Style (17th ed.) CitationTripathi, Nikhil, Prince Setia, Swapnil Sawalkar, K. Mondal, and Shashank Shekhar. "Novel Asymmetric CCRP Die Geometry for Optimized Microstructure and Outstanding Failure Tolerance." Journal of Materials Engineering & Performance 35, no. 18 (2026): 18384. https://doi.org/10.1007/s11665-025-12942-4.
MLA (9th ed.) CitationTripathi, Nikhil, et al. "Novel Asymmetric CCRP Die Geometry for Optimized Microstructure and Outstanding Failure Tolerance." Journal of Materials Engineering & Performance, vol. 35, no. 18, 2026, p. 18384, https://doi.org/10.1007/s11665-025-12942-4.