APA (7th ed.) Citation

Tripathi, N., Setia, P., Sawalkar, S., Mondal, K., & Shekhar, S. (2026). Novel Asymmetric CCRP Die Geometry for Optimized Microstructure and Outstanding Failure Tolerance. Journal of Materials Engineering & Performance, 35(18), 18384. https://doi.org/10.1007/s11665-025-12942-4

Chicago Style (17th ed.) Citation

Tripathi, Nikhil, Prince Setia, Swapnil Sawalkar, K. Mondal, and Shashank Shekhar. "Novel Asymmetric CCRP Die Geometry for Optimized Microstructure and Outstanding Failure Tolerance." Journal of Materials Engineering & Performance 35, no. 18 (2026): 18384. https://doi.org/10.1007/s11665-025-12942-4.

MLA (9th ed.) Citation

Tripathi, Nikhil, et al. "Novel Asymmetric CCRP Die Geometry for Optimized Microstructure and Outstanding Failure Tolerance." Journal of Materials Engineering & Performance, vol. 35, no. 18, 2026, p. 18384, https://doi.org/10.1007/s11665-025-12942-4.

Warning: These citations may not always be 100% accurate.