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基于 MEMS 探卡的 WLP 晶圆芯片测试研究.

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Title: 基于 MEMS 探卡的 WLP 晶圆芯片测试研究. (Chinese)
Authors: 伍 平1, 李桦林1, 唐小龙1, 高钰奇1, 王 鹏1, 毛 琨1, 付红霞1
Source: Piezoelectrics & Acoustooptics; Apr2026, Vol. 48 Issue 2, p350-354, 5p
Database: Applied Science & Technology Source
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  Availability: 0
Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 193790293
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
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      – Type: doi
        Value: 10.11977/j.issn.1004-2474.2026.02.021
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      – Code: chi
        Text: Chinese
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        PageCount: 5
        StartPage: 350
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      – TitleFull: 基于 MEMS 探卡的 WLP 晶圆芯片测试研究.
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            NameFull: 伍 平
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            NameFull: 李桦林
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            NameFull: 唐小龙
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            NameFull: 高钰奇
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            NameFull: 王 鹏
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            NameFull: 毛 琨
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            – D: 01
              M: 04
              Text: Apr2026
              Type: published
              Y: 2026
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              Value: 48
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