APA (7th ed.) Citation

Wu, T., Shen, J., Zou, J., Liao, Y., & Wu, P. (2026). Impact of Thermally Conductive Adhesive Film on the Thermal Reliability of Multi-Chip COB LED Packages. Applied Sciences (2076-3417), 16(10), 4597. https://doi.org/10.3390/app16104597

Chicago Style (17th ed.) Citation

Wu, Tianqi, Jichen Shen, Jun Zou, Yitao Liao, and Peng Wu. "Impact of Thermally Conductive Adhesive Film on the Thermal Reliability of Multi-Chip COB LED Packages." Applied Sciences (2076-3417) 16, no. 10 (2026): 4597. https://doi.org/10.3390/app16104597.

MLA (9th ed.) Citation

Wu, Tianqi, et al. "Impact of Thermally Conductive Adhesive Film on the Thermal Reliability of Multi-Chip COB LED Packages." Applied Sciences (2076-3417), vol. 16, no. 10, 2026, p. 4597, https://doi.org/10.3390/app16104597.