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Impact of Thermally Conductive Adhesive Film on the Thermal Reliability of Multi-Chip COB LED Packages.

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Title: Impact of Thermally Conductive Adhesive Film on the Thermal Reliability of Multi-Chip COB LED Packages.
Authors: Wu, Tianqi1, Shen, Jichen1,2, Zou, Jun1,3, zoujun@sit.edu.cn, Liao, Yitao1,2, Wu, Peng2,3
Source: Applied Sciences (2076-3417); May2026, Vol. 16 Issue 10, p4597, 20p
Database: Applied Science & Technology Source
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        Value: 10.3390/app16104597
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        Text: English
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      – TitleFull: Impact of Thermally Conductive Adhesive Film on the Thermal Reliability of Multi-Chip COB LED Packages.
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              Text: May2026
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