Vanfleet, R. B., Bright, V. M., & George, S. M. (2026). Film and surface stress during Al2O3 thermal atomic layer etching using in situ wafer curvature measurements. Journal of Vacuum Science & Technology: Part A-Vacuums, Surfaces & Films, 44(3), 1. https://doi.org/10.1116/6.0005425
Chicago Style (17th ed.) CitationVanfleet, Ryan B., Victor M. Bright, and Steven M. George. "Film and Surface Stress During Al2O3 Thermal Atomic Layer Etching Using in Situ Wafer Curvature Measurements." Journal of Vacuum Science & Technology: Part A-Vacuums, Surfaces & Films 44, no. 3 (2026): 1. https://doi.org/10.1116/6.0005425.
MLA (9th ed.) CitationVanfleet, Ryan B., et al. "Film and Surface Stress During Al2O3 Thermal Atomic Layer Etching Using in Situ Wafer Curvature Measurements." Journal of Vacuum Science & Technology: Part A-Vacuums, Surfaces & Films, vol. 44, no. 3, 2026, p. 1, https://doi.org/10.1116/6.0005425.