Film and surface stress during Al2O3 thermal atomic layer etching using in situ wafer curvature measurements.
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| Title: | Film and surface stress during Al2O3 thermal atomic layer etching using in situ wafer curvature measurements. |
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| Authors: | Vanfleet, Ryan B.1, Bright, Victor M.2, George, Steven M.1, Steven.George@Colorado.edu |
| Source: | Journal of Vacuum Science & Technology: Part A-Vacuums, Surfaces & Films; May2026, Vol. 44 Issue 3, p1-9, 9p |
| Database: | Applied Science & Technology Source |
| ISSN: | 07342101 |
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| DOI: | 10.1116/6.0005425 |
