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Microstructural Refinement and Interfacial Evolution of Ge addition Sn-Bi-Zn Medium-Entropy Solders.

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Title: Microstructural Refinement and Interfacial Evolution of Ge addition Sn-Bi-Zn Medium-Entropy Solders.
Authors: Li, Su1,2, Yue, Zhiyang1,2, Huang, Jianeng1,2, Dai, Pinqiang1,2, Pan, Huiyuan1,2, Tian, Jun1,2, tianj2003@126.com, Lin, Chun-Ming3, chunming@nkust.edu.tw
Source: Journal of Electronic Materials; Jul2026, Vol. 55 Issue 7, p6337-6350, 14p
Database: Applied Science & Technology Source
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  Availability: 0
Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 194546576
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Microstructural Refinement and Interfacial Evolution of Ge addition Sn-Bi-Zn Medium-Entropy Solders.
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  Data: <searchLink fieldCode="AU" term="%22Li%2C+Su%22">Li, Su</searchLink><relatesTo>1,2</relatesTo><br /><searchLink fieldCode="AU" term="%22Yue%2C+Zhiyang%22">Yue, Zhiyang</searchLink><relatesTo>1,2</relatesTo><br /><searchLink fieldCode="AU" term="%22Huang%2C+Jianeng%22">Huang, Jianeng</searchLink><relatesTo>1,2</relatesTo><br /><searchLink fieldCode="AU" term="%22Dai%2C+Pinqiang%22">Dai, Pinqiang</searchLink><relatesTo>1,2</relatesTo><br /><searchLink fieldCode="AU" term="%22Pan%2C+Huiyuan%22">Pan, Huiyuan</searchLink><relatesTo>1,2</relatesTo><br /><searchLink fieldCode="AU" term="%22Tian%2C+Jun%22">Tian, Jun</searchLink><relatesTo>1,2</relatesTo>, <i>tianj2003@126.com</i><br /><searchLink fieldCode="AU" term="%22Lin%2C+Chun-Ming%22">Lin, Chun-Ming</searchLink><relatesTo>3</relatesTo>, <i>chunming@nkust.edu.tw</i>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Electronic+Materials%22">Journal of Electronic Materials</searchLink>; Jul2026, Vol. 55 Issue 7, p6337-6350, 14p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=194546576
RecordInfo BibRecord:
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    Identifiers:
      – Type: doi
        Value: 10.1007/s11664-026-12881-3
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      – Code: eng
        Text: English
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        PageCount: 14
        StartPage: 6337
    Titles:
      – TitleFull: Microstructural Refinement and Interfacial Evolution of Ge addition Sn-Bi-Zn Medium-Entropy Solders.
        Type: main
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      – PersonEntity:
          Name:
            NameFull: Li, Su
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            NameFull: Yue, Zhiyang
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            NameFull: Huang, Jianeng
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            NameFull: Dai, Pinqiang
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            NameFull: Pan, Huiyuan
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            NameFull: Tian, Jun
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            NameFull: Lin, Chun-Ming
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          Dates:
            – D: 01
              M: 07
              Text: Jul2026
              Type: published
              Y: 2026
          Identifiers:
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              Value: 03615235
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              Value: 55
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              Value: 7
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            – TitleFull: Journal of Electronic Materials
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