APA (7th ed.) Citation

Satish, A. M., Vatnalmath, M., Bharath, V., Auradi, V., VijayKashimatt, M. G., Veeresh, V., . . . Nagaral, M. (2026). Taguchi optimised ANN architecture for enhanced predictive accuracy in solid state diffusion bonding of Al-Cu alloy 2219 and copper. Canadian Metallurgical Quarterly, 65(3), 2866. https://doi.org/10.1080/00084433.2025.2578557

Chicago Style (17th ed.) Citation

Satish, A. M., M. Vatnalmath, V. Bharath, V. Auradi, M. G. VijayKashimatt, V. Veeresh, S. N. Srinivas, and M. Nagaral. "Taguchi Optimised ANN Architecture for Enhanced Predictive Accuracy in Solid State Diffusion Bonding of Al-Cu Alloy 2219 and Copper." Canadian Metallurgical Quarterly 65, no. 3 (2026): 2866. https://doi.org/10.1080/00084433.2025.2578557.

MLA (9th ed.) Citation

Satish, A. M., et al. "Taguchi Optimised ANN Architecture for Enhanced Predictive Accuracy in Solid State Diffusion Bonding of Al-Cu Alloy 2219 and Copper." Canadian Metallurgical Quarterly, vol. 65, no. 3, 2026, p. 2866, https://doi.org/10.1080/00084433.2025.2578557.