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Taguchi optimised ANN architecture for enhanced predictive accuracy in solid state diffusion bonding of Al-Cu alloy 2219 and copper.

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Title: Taguchi optimised ANN architecture for enhanced predictive accuracy in solid state diffusion bonding of Al-Cu alloy 2219 and copper.
Authors: Satish, A. M.1, Vatnalmath, M.2, Bharath, V.2, Auradi, V.1, vsauradi@gmail.com, VijayKashimatt, M. G.3, Veeresh, V.2, Srinivas, S. N.2, Nagaral, M.4
Source: Canadian Metallurgical Quarterly; Jul2026, Vol. 65 Issue 3, p2866-2879, 14p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 194641521
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Taguchi optimised ANN architecture for enhanced predictive accuracy in solid state diffusion bonding of Al-Cu alloy 2219 and copper.
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  Data: <searchLink fieldCode="JN" term="%22Canadian+Metallurgical+Quarterly%22">Canadian Metallurgical Quarterly</searchLink>; Jul2026, Vol. 65 Issue 3, p2866-2879, 14p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=194641521
RecordInfo BibRecord:
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      – Type: doi
        Value: 10.1080/00084433.2025.2578557
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      – Code: eng
        Text: English
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      Pagination:
        PageCount: 14
        StartPage: 2866
    Titles:
      – TitleFull: Taguchi optimised ANN architecture for enhanced predictive accuracy in solid state diffusion bonding of Al-Cu alloy 2219 and copper.
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            NameFull: Satish, A. M.
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            NameFull: Vatnalmath, M.
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            NameFull: Bharath, V.
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            NameFull: Auradi, V.
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            NameFull: VijayKashimatt, M. G.
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            – D: 01
              M: 07
              Text: Jul2026
              Type: published
              Y: 2026
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            – TitleFull: Canadian Metallurgical Quarterly
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