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When technostress meets telepressure: a multi-dimensional well-being approach.

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Bibliographic Details
Title: When technostress meets telepressure: a multi-dimensional well-being approach.
Authors: Booker, Luke1, l.booker@griffith.edu.au, Islam, Md Shamirul2, Shamirul.Islam@taylors.edu.my, Cafferkey, Kenneth3, kennethc@sunway.edu.my, Townsend, Keith1, k.townsend@griffith.edu.au, Ong, Xue Ying3, ongxueying59@gmail.com
Source: Industrial Management & Data Systems; 2026, Vol. 126 Issue 7, p2113-2131, 19p
Database: Applied Science & Technology Source
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