APA (7th ed.) Citation

Jiang, H., Guan, Y., Shen, J., Luo, D., & Chen, Q. (2026). Effect of Cu@Ag and nano-Co on the performance of IMC skeleton solder joints. Journal of Materials Science: Materials in Electronics, 37(19), 1. https://doi.org/10.1007/s10854-026-17838-0

Chicago Style (17th ed.) Citation

Jiang, Hui, Yujie Guan, Jun Shen, D. Luo, and Q. Chen. "Effect of Cu@Ag and Nano-Co on the Performance of IMC Skeleton Solder Joints." Journal of Materials Science: Materials in Electronics 37, no. 19 (2026): 1. https://doi.org/10.1007/s10854-026-17838-0.

MLA (9th ed.) Citation

Jiang, Hui, et al. "Effect of Cu@Ag and Nano-Co on the Performance of IMC Skeleton Solder Joints." Journal of Materials Science: Materials in Electronics, vol. 37, no. 19, 2026, p. 1, https://doi.org/10.1007/s10854-026-17838-0.