Effect of Cu@Ag and nano-Co on the performance of IMC skeleton solder joints.
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| Title: | Effect of Cu@Ag and nano-Co on the performance of IMC skeleton solder joints. |
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| Authors: | Jiang, Hui1, Guan, Yujie1, Shen, Jun1, shenjun@cqu.edu.cn, Luo, D.2, Chen, Q.2 |
| Source: | Journal of Materials Science: Materials in Electronics; Jul2026, Vol. 37 Issue 19, p1-19, 19p |
| Database: | Applied Science & Technology Source |
| ISSN: | 09574522 |
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| DOI: | 10.1007/s10854-026-17838-0 |
