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Effect of Cu@Ag and nano-Co on the performance of IMC skeleton solder joints.

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Title: Effect of Cu@Ag and nano-Co on the performance of IMC skeleton solder joints.
Authors: Jiang, Hui1, Guan, Yujie1, Shen, Jun1, shenjun@cqu.edu.cn, Luo, D.2, Chen, Q.2
Source: Journal of Materials Science: Materials in Electronics; Jul2026, Vol. 37 Issue 19, p1-19, 19p
Database: Applied Science & Technology Source
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  Availability: 0
Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 194969983
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Effect of Cu@Ag and nano-Co on the performance of IMC skeleton solder joints.
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%3A+Materials+in+Electronics%22">Journal of Materials Science: Materials in Electronics</searchLink>; Jul2026, Vol. 37 Issue 19, p1-19, 19p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=194969983
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      – Type: doi
        Value: 10.1007/s10854-026-17838-0
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      – Code: eng
        Text: English
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        PageCount: 19
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      – TitleFull: Effect of Cu@Ag and nano-Co on the performance of IMC skeleton solder joints.
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            NameFull: Jiang, Hui
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            NameFull: Guan, Yujie
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            NameFull: Shen, Jun
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            NameFull: Luo, D.
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            – D: 01
              M: 07
              Text: Jul2026
              Type: published
              Y: 2026
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              Value: 37
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            – TitleFull: Journal of Materials Science: Materials in Electronics
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