APA (7th ed.) Citation

Tchoulfian, P., Barge, D., Hartmann, J., Kerdilès, S., Larrey, V., Fournel, F., . . . Chan, B. (2026). CFET channel stack fabrication by wafer-to-wafer bonding and BESOI donor dismounting. Materials Science in Semiconductor Processing, 214, N.PAG. https://doi.org/10.1016/j.mssp.2026.110826

Chicago Style (17th ed.) Citation

Tchoulfian, P., et al. "CFET Channel Stack Fabrication by Wafer-to-wafer Bonding and BESOI Donor Dismounting." Materials Science in Semiconductor Processing 214 (2026): N.PAG. https://doi.org/10.1016/j.mssp.2026.110826.

MLA (9th ed.) Citation

Tchoulfian, P., et al. "CFET Channel Stack Fabrication by Wafer-to-wafer Bonding and BESOI Donor Dismounting." Materials Science in Semiconductor Processing, vol. 214, 2026, p. N.PAG, https://doi.org/10.1016/j.mssp.2026.110826.