Thermal Deformation of External Wall Insulation Systems Using EPS, XPS and PU Boards: A Combined Numerical and Experimental Study.

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Title: Thermal Deformation of External Wall Insulation Systems Using EPS, XPS and PU Boards: A Combined Numerical and Experimental Study.
Authors: Li, Linlin1, Liu, Jiayou1,2, liujy@sdust.edu.cn, Li, Siyu1,3, Song, Junhao1, Li, Xin2, Li, Jingyang3
Source: Buildings (2075-5309); Jul2026, Vol. 16 Issue 13, p2599, 21p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 195442015
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
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  Data: Thermal Deformation of External Wall Insulation Systems Using EPS, XPS and PU Boards: A Combined Numerical and Experimental Study.
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  Data: <searchLink fieldCode="AU" term="%22Li%2C+Linlin%22">Li, Linlin</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Liu%2C+Jiayou%22">Liu, Jiayou</searchLink><relatesTo>1,2</relatesTo>, <i>liujy@sdust.edu.cn</i><br /><searchLink fieldCode="AU" term="%22Li%2C+Siyu%22">Li, Siyu</searchLink><relatesTo>1,3</relatesTo><br /><searchLink fieldCode="AU" term="%22Song%2C+Junhao%22">Song, Junhao</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Li%2C+Xin%22">Li, Xin</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Li%2C+Jingyang%22">Li, Jingyang</searchLink><relatesTo>3</relatesTo>
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  Data: <searchLink fieldCode="JN" term="%22Buildings+%282075-5309%29%22">Buildings (2075-5309)</searchLink>; Jul2026, Vol. 16 Issue 13, p2599, 21p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=195442015
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      – Type: doi
        Value: 10.3390/buildings16132599
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      – Code: eng
        Text: English
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        PageCount: 21
        StartPage: 2599
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      – TitleFull: Thermal Deformation of External Wall Insulation Systems Using EPS, XPS and PU Boards: A Combined Numerical and Experimental Study.
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            NameFull: Li, Linlin
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              M: 07
              Text: Jul2026
              Type: published
              Y: 2026
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