1/f noise and electromigration in multilayered via structures.
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| Title: | 1/f noise and electromigration in multilayered via structures. |
|---|---|
| Authors: | Çelik-Butler, Z., Zhang, R., Patel, N. |
| Source: | Solid-State Electronics; February 1996, Vol. 39, p281-286, 6p |
| Database: | Applied Science & Technology Source |
| FullText | Text: Availability: 0 |
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| Header | DbId: aci DbLabel: Applied Science & Technology Source An: 500269548 AccessLevel: 2 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: 1/f noise and electromigration in multilayered via structures. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AU" term="%22Çelik-Butler%2C+Z%2E%22">Çelik-Butler, Z.</searchLink><br /><searchLink fieldCode="AU" term="%22Zhang%2C+R%2E%22">Zhang, R.</searchLink><br /><searchLink fieldCode="AU" term="%22Patel%2C+N%2E%22">Patel, N.</searchLink> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Solid-State+Electronics%22">Solid-State Electronics</searchLink>; February 1996, Vol. 39, p281-286, 6p |
| PLink | https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=500269548 |
| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1016/0038-1101(95)00127-1 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 6 StartPage: 281 Titles: – TitleFull: 1/f noise and electromigration in multilayered via structures. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Çelik-Butler, Z. – PersonEntity: Name: NameFull: Zhang, R. – PersonEntity: Name: NameFull: Patel, N. IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 02 Text: February 1996 Type: published Y: 1996 Identifiers: – Type: issn-print Value: 00381101 Numbering: – Type: volume Value: 39 Titles: – TitleFull: Solid-State Electronics Type: main |
| ResultId | 1 |