APA (7th ed.) Citation

Çelik-Butler, Z. (1996). 1/f noise as an electromigration characterization tool for W-plug vias between TiN/Al-Cu/TiN metallizations. Solid-State Electronics, 39, 999. https://doi.org/10.1016/0038-1101(95)00411-4

Chicago Style (17th ed.) Citation

Çelik-Butler, Z. "1/f Noise as an Electromigration Characterization Tool for W-plug Vias Between TiN/Al-Cu/TiN Metallizations." Solid-State Electronics 39 (1996): 999. https://doi.org/10.1016/0038-1101(95)00411-4.

MLA (9th ed.) Citation

Çelik-Butler, Z. "1/f Noise as an Electromigration Characterization Tool for W-plug Vias Between TiN/Al-Cu/TiN Metallizations." Solid-State Electronics, vol. 39, 1996, p. 999, https://doi.org/10.1016/0038-1101(95)00411-4.