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1/f noise as an electromigration characterization tool for W-plug vias between TiN/Al-Cu/TiN metallizations.

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Bibliographic Details
Title: 1/f noise as an electromigration characterization tool for W-plug vias between TiN/Al-Cu/TiN metallizations.
Authors: Çelik-Butler, Z.
Source: Solid-State Electronics; July 1996, Vol. 39, p999-1003, 5p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 500331215
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
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  Data: 1/f noise as an electromigration characterization tool for W-plug vias between TiN/Al-Cu/TiN metallizations.
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        Value: 10.1016/0038-1101(95)00411-4
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      – Code: eng
        Text: English
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        PageCount: 5
        StartPage: 999
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      – TitleFull: 1/f noise as an electromigration characterization tool for W-plug vias between TiN/Al-Cu/TiN metallizations.
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              Text: July 1996
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              Y: 1996
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              Value: 39
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            – TitleFull: Solid-State Electronics
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