Young, F. Y., Chu, C. C. N., & Luk, W. S. (2001). Handling soft modules in genral nonslicing floorplan using Lagrangian relaxation. IEEE Transactions on Computer-Aided Design of Integrated Circuits & Systems, 20(5), 687. https://doi.org/10.1109/43.920707
Chicago Style (17th ed.) CitationYoung, F. Y., Chris C. N. Chu, and W. S. Luk. "Handling Soft Modules in Genral Nonslicing Floorplan Using Lagrangian Relaxation." IEEE Transactions on Computer-Aided Design of Integrated Circuits & Systems 20, no. 5 (2001): 687. https://doi.org/10.1109/43.920707.
MLA (9th ed.) CitationYoung, F. Y., et al. "Handling Soft Modules in Genral Nonslicing Floorplan Using Lagrangian Relaxation." IEEE Transactions on Computer-Aided Design of Integrated Circuits & Systems, vol. 20, no. 5, 2001, p. 687, https://doi.org/10.1109/43.920707.