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Shear deformation in Sn-3.5Ag and Sn-3.6Ag-1.0Cu solder joints subjected to asymmetric four-point bend tests.

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Bibliographic Details
Title: Shear deformation in Sn-3.5Ag and Sn-3.6Ag-1.0Cu solder joints subjected to asymmetric four-point bend tests.
Authors: Cook, B. A., Anderson, I. E., Harringa, J. L.
Source: Journal of Electronic Materials; September 2001, Vol. 30 Issue 9, p1214-1221, 8p
Database: Applied Science & Technology Source
FullText Text:
  Availability: 0
Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 500795674
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Shear deformation in Sn-3.5Ag and Sn-3.6Ag-1.0Cu solder joints subjected to asymmetric four-point bend tests.
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  Data: <searchLink fieldCode="AU" term="%22Cook%2C+B%2E+A%2E%22">Cook, B. A.</searchLink><br /><searchLink fieldCode="AU" term="%22Anderson%2C+I%2E+E%2E%22">Anderson, I. E.</searchLink><br /><searchLink fieldCode="AU" term="%22Harringa%2C+J%2E+L%2E%22">Harringa, J. L.</searchLink>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Electronic+Materials%22">Journal of Electronic Materials</searchLink>; September 2001, Vol. 30 Issue 9, p1214-1221, 8p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=500795674
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      – Type: doi
        Value: 10.1007/s11664-001-0152-6
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      – Code: eng
        Text: English
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        PageCount: 8
        StartPage: 1214
    Titles:
      – TitleFull: Shear deformation in Sn-3.5Ag and Sn-3.6Ag-1.0Cu solder joints subjected to asymmetric four-point bend tests.
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            NameFull: Cook, B. A.
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            NameFull: Anderson, I. E.
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            NameFull: Harringa, J. L.
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              M: 09
              Text: September 2001
              Type: published
              Y: 2001
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              Value: 30
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              Value: 9
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