APA (7th ed.) Citation

Anderson, I. E., Cook, B. A., & Harringa, J. L. (2002). Sn-Ag-Cu Solders and Solder Joints: Alloy Development, Microstructure, and Properties. JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 54(6), 26. https://doi.org/10.1007/BF02701845

Chicago Style (17th ed.) Citation

Anderson, I. E., B. A. Cook, and J. L. Harringa. "Sn-Ag-Cu Solders and Solder Joints: Alloy Development, Microstructure, and Properties." JOM: The Journal of The Minerals, Metals & Materials Society (TMS) 54, no. 6 (2002): 26. https://doi.org/10.1007/BF02701845.

MLA (9th ed.) Citation

Anderson, I. E., et al. "Sn-Ag-Cu Solders and Solder Joints: Alloy Development, Microstructure, and Properties." JOM: The Journal of The Minerals, Metals & Materials Society (TMS), vol. 54, no. 6, 2002, p. 26, https://doi.org/10.1007/BF02701845.