Sn-Ag-Cu Solders and Solder Joints: Alloy Development, Microstructure, and Properties.
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| Title: | Sn-Ag-Cu Solders and Solder Joints: Alloy Development, Microstructure, and Properties. |
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| Authors: | Anderson, I. E., Cook, B. A., Harringa, J. L. |
| Source: | JOM: The Journal of The Minerals, Metals & Materials Society (TMS); June 2002, Vol. 54 Issue 6, p26-29, 4p |
| Database: | Applied Science & Technology Source |
| ISSN: | 10474838 |
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| DOI: | 10.1007/BF02701845 |
