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Sn-Ag-Cu Solders and Solder Joints: Alloy Development, Microstructure, and Properties.

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Bibliographic Details
Title: Sn-Ag-Cu Solders and Solder Joints: Alloy Development, Microstructure, and Properties.
Authors: Anderson, I. E., Cook, B. A., Harringa, J. L.
Source: JOM: The Journal of The Minerals, Metals & Materials Society (TMS); June 2002, Vol. 54 Issue 6, p26-29, 4p
Database: Applied Science & Technology Source
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  Availability: 0
Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 500878736
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Sn-Ag-Cu Solders and Solder Joints: Alloy Development, Microstructure, and Properties.
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      – Type: doi
        Value: 10.1007/BF02701845
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      – Code: eng
        Text: English
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        PageCount: 4
        StartPage: 26
    Titles:
      – TitleFull: Sn-Ag-Cu Solders and Solder Joints: Alloy Development, Microstructure, and Properties.
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            NameFull: Anderson, I. E.
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            NameFull: Cook, B. A.
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            NameFull: Harringa, J. L.
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            – D: 01
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              Text: June 2002
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              Y: 2002
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              Value: 54
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              Value: 6
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            – TitleFull: JOM: The Journal of The Minerals, Metals & Materials Society (TMS)
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