A Review of Electrocoupling Mechanisms Mediating Facilitated Wound Healing.
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| Title: | A Review of Electrocoupling Mechanisms Mediating Facilitated Wound Healing. |
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| Authors: | Cho, Michael R. |
| Source: | IEEE Transactions on Plasma Science; August 2002 pt1, Vol. 30 Issue 4, p1504-1515, 12p |
| Database: | Applied Science & Technology Source |
| FullText | Text: Availability: 0 |
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| Header | DbId: aci DbLabel: Applied Science & Technology Source An: 500910075 AccessLevel: 2 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| PLink | https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=500910075 |
| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1109/TPS.2002.804200 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 12 StartPage: 1504 Titles: – TitleFull: A Review of Electrocoupling Mechanisms Mediating Facilitated Wound Healing. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Cho, Michael R. IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 08 Text: August 2002 pt1 Type: published Y: 2002 Identifiers: – Type: issn-print Value: 00933813 Numbering: – Type: volume Value: 30 – Type: issue Value: 4 Titles: – TitleFull: IEEE Transactions on Plasma Science Type: main |
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