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Electromigration Studies of Flip Chip Sn95/Sb5 Solder Bumps on Cr/Cr-Cu/Cu Under-Bump Metallization.

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Bibliographic Details
Title: Electromigration Studies of Flip Chip Sn95/Sb5 Solder Bumps on Cr/Cr-Cu/Cu Under-Bump Metallization.
Authors: Shao, T. L., Lin, K. C., Chen, Chih
Source: Journal of Electronic Materials; November 2003, Vol. 32 Issue 11, p1278-1283, 6p
Database: Applied Science & Technology Source
Description
ISSN:03615235
DOI:10.1007/s11664-003-0023-4