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Electromigration Studies of Flip Chip Sn95/Sb5 Solder Bumps on Cr/Cr-Cu/Cu Under-Bump Metallization.

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Title: Electromigration Studies of Flip Chip Sn95/Sb5 Solder Bumps on Cr/Cr-Cu/Cu Under-Bump Metallization.
Authors: Shao, T. L., Lin, K. C., Chen, Chih
Source: Journal of Electronic Materials; November 2003, Vol. 32 Issue 11, p1278-1283, 6p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 500911330
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Electromigration Studies of Flip Chip Sn95/Sb5 Solder Bumps on Cr/Cr-Cu/Cu Under-Bump Metallization.
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  Data: <searchLink fieldCode="AU" term="%22Shao%2C+T%2E+L%2E%22">Shao, T. L.</searchLink><br /><searchLink fieldCode="AU" term="%22Lin%2C+K%2E+C%2E%22">Lin, K. C.</searchLink><br /><searchLink fieldCode="AU" term="%22Chen%2C+Chih%22">Chen, Chih</searchLink>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Electronic+Materials%22">Journal of Electronic Materials</searchLink>; November 2003, Vol. 32 Issue 11, p1278-1283, 6p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=500911330
RecordInfo BibRecord:
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    Identifiers:
      – Type: doi
        Value: 10.1007/s11664-003-0023-4
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      – Code: eng
        Text: English
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      Pagination:
        PageCount: 6
        StartPage: 1278
    Titles:
      – TitleFull: Electromigration Studies of Flip Chip Sn95/Sb5 Solder Bumps on Cr/Cr-Cu/Cu Under-Bump Metallization.
        Type: main
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            NameFull: Shao, T. L.
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            NameFull: Lin, K. C.
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            NameFull: Chen, Chih
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            – D: 01
              M: 11
              Text: November 2003
              Type: published
              Y: 2003
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              Value: 32
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              Value: 11
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            – TitleFull: Journal of Electronic Materials
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