Cook, B. A., Anderson, I. E., & Harringa, J. L. (2002). Effect of Heat Treatment on the Electrical Resistivity of Near-Eutectic Sn-Ag-Cu Pb-Free Solder Alloys. Journal of Electronic Materials, 31(11), 1190. https://doi.org/10.1007/s11664-002-0009-7
Chicago Style (17th ed.) CitationCook, B. A., I. E. Anderson, and J. L. Harringa. "Effect of Heat Treatment on the Electrical Resistivity of Near-Eutectic Sn-Ag-Cu Pb-Free Solder Alloys." Journal of Electronic Materials 31, no. 11 (2002): 1190. https://doi.org/10.1007/s11664-002-0009-7.
MLA (9th ed.) CitationCook, B. A., et al. "Effect of Heat Treatment on the Electrical Resistivity of Near-Eutectic Sn-Ag-Cu Pb-Free Solder Alloys." Journal of Electronic Materials, vol. 31, no. 11, 2002, p. 1190, https://doi.org/10.1007/s11664-002-0009-7.