APA (7th ed.) Citation

Sedky, S., Howe, R. T., & King, T. (2004). Pulsed-Laser Annealing, a Low-Thermal-Budget Technique for Eliminating Stress Gradient in Poly-SiGe MEMS Structures. Journal of Microelectromechanical Systems, 13(4), 669. https://doi.org/10.1109/JMEMS.2004.832189

Chicago Style (17th ed.) Citation

Sedky, Sherif, Roger T. Howe, and Tsu-Jac King. "Pulsed-Laser Annealing, a Low-Thermal-Budget Technique for Eliminating Stress Gradient in Poly-SiGe MEMS Structures." Journal of Microelectromechanical Systems 13, no. 4 (2004): 669. https://doi.org/10.1109/JMEMS.2004.832189.

MLA (9th ed.) Citation

Sedky, Sherif, et al. "Pulsed-Laser Annealing, a Low-Thermal-Budget Technique for Eliminating Stress Gradient in Poly-SiGe MEMS Structures." Journal of Microelectromechanical Systems, vol. 13, no. 4, 2004, p. 669, https://doi.org/10.1109/JMEMS.2004.832189.