APA (7th ed.) Citation

Lin, Y. L., Luo, W. C., & Lin, Y. H. (2004). Effects of the Gold Thickness of the Surface Finish on the Interfacial Reactions in Flip-Chip Solder Joints. Journal of Electronic Materials, 33(10), 1092. https://doi.org/10.1007/s11664-004-0109-7

Chicago Style (17th ed.) Citation

Lin, Y. L., W. C. Luo, and Y. H. Lin. "Effects of the Gold Thickness of the Surface Finish on the Interfacial Reactions in Flip-Chip Solder Joints." Journal of Electronic Materials 33, no. 10 (2004): 1092. https://doi.org/10.1007/s11664-004-0109-7.

MLA (9th ed.) Citation

Lin, Y. L., et al. "Effects of the Gold Thickness of the Surface Finish on the Interfacial Reactions in Flip-Chip Solder Joints." Journal of Electronic Materials, vol. 33, no. 10, 2004, p. 1092, https://doi.org/10.1007/s11664-004-0109-7.