Effects of the Gold Thickness of the Surface Finish on the Interfacial Reactions in Flip-Chip Solder Joints.

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Bibliographic Details
Title:	Effects of the Gold Thickness of the Surface Finish on the Interfacial Reactions in Flip-Chip Solder Joints.
Authors:	Lin, Y. L., Luo, W. C., Lin, Y. H.
Source:	Journal of Electronic Materials; Oct2004, Vol. 33 Issue 10, p1092-1097, 6p
Database:	Applied Science & Technology Source

Description
ISSN:	03615235
DOI:	10.1007/s11664-004-0109-7