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| Header | DbId: aci DbLabel: Applied Science & Technology Source An: 501064839 AccessLevel: 2 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Ceramics Bonding Using Solder Glass Frit. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AU" term="%22Sun%2C+Z%2E%22">Sun, Z.</searchLink><br /><searchLink fieldCode="AU" term="%22Pan%2C+D%2E%22">Pan, D.</searchLink><br /><searchLink fieldCode="AU" term="%22Wei%2C+J%2E%22">Wei, J.</searchLink> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Journal+of+Electronic+Materials%22">Journal of Electronic Materials</searchLink>; Dec2004, Vol. 33 Issue 12, p1516-1523, 8p |
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| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1007/s11664-004-0093-y Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 8 StartPage: 1516 Titles: – TitleFull: Ceramics Bonding Using Solder Glass Frit. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Sun, Z. – PersonEntity: Name: NameFull: Pan, D. – PersonEntity: Name: NameFull: Wei, J. IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 12 Text: Dec2004 Type: published Y: 2004 Identifiers: – Type: issn-print Value: 03615235 Numbering: – Type: volume Value: 33 – Type: issue Value: 12 Titles: – TitleFull: Journal of Electronic Materials Type: main |
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