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Interfacial Reactions between CuxNiy Alloy Underbump Metallurgy and Sn-Ag-zCu Solders.

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Bibliographic Details
Title: Interfacial Reactions between CuxNiy Alloy Underbump Metallurgy and Sn-Ag-zCu Solders.
Authors: Han, H., Sohn, Y. C., Yu, Jin
Source: Journal of Electronic Materials; May 2007, Vol. 36 Issue 5, p578-586, 9p
Database: Applied Science & Technology Source
Description
ISSN:03615235
DOI:10.1007/s11664-006-0049-5