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Interfacial Reactions between CuxNiy Alloy Underbump Metallurgy and Sn-Ag-zCu Solders.

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Bibliographic Details
Title: Interfacial Reactions between CuxNiy Alloy Underbump Metallurgy and Sn-Ag-zCu Solders.
Authors: Han, H., Sohn, Y. C., Yu, Jin
Source: Journal of Electronic Materials; May 2007, Vol. 36 Issue 5, p578-586, 9p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 501419548
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
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  Data: Interfacial Reactions between CuxNiy Alloy Underbump Metallurgy and Sn-Ag-zCu Solders.
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Electronic+Materials%22">Journal of Electronic Materials</searchLink>; May 2007, Vol. 36 Issue 5, p578-586, 9p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=501419548
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        Value: 10.1007/s11664-006-0049-5
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      – Code: eng
        Text: English
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        PageCount: 9
        StartPage: 578
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      – TitleFull: Interfacial Reactions between CuxNiy Alloy Underbump Metallurgy and Sn-Ag-zCu Solders.
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            NameFull: Han, H.
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            NameFull: Sohn, Y. C.
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            NameFull: Yu, Jin
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            – D: 01
              M: 05
              Text: May 2007
              Type: published
              Y: 2007
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              Value: 36
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