APA (7th ed.) Citation

Yang, P., Jian, S., & Lai, Y. (2009). Nanotribological Characteristics of Cu6Sn5, Cu3Sn, and Ni3Sn4 Intermetallic Compounds. Journal of Electronic Materials, 38(6), 810. https://doi.org/10.1007/s11664-009-0766-7

Chicago Style (17th ed.) Citation

Yang, Ping-Feng, Sheng-Rui Jian, and Yi-Shao Lai. "Nanotribological Characteristics of Cu6Sn5, Cu3Sn, and Ni3Sn4 Intermetallic Compounds." Journal of Electronic Materials 38, no. 6 (2009): 810. https://doi.org/10.1007/s11664-009-0766-7.

MLA (9th ed.) Citation

Yang, Ping-Feng, et al. "Nanotribological Characteristics of Cu6Sn5, Cu3Sn, and Ni3Sn4 Intermetallic Compounds." Journal of Electronic Materials, vol. 38, no. 6, 2009, p. 810, https://doi.org/10.1007/s11664-009-0766-7.