Effect of UBM Thickness on the Mean Time to Failure of Flip-Chip Solder Joints under Electromigration.

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Bibliographic Details
Title:	Effect of UBM Thickness on the Mean Time to Failure of Flip-Chip Solder Joints under Electromigration.
Authors:	Lin, Y. L., Lai, Y. S., Lin, Y. W.
Source:	Journal of Electronic Materials; January 2008, Vol. 37 Issue 1, p96-101, 6p
Database:	Applied Science & Technology Source

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