Effect of Au contamination on the electrical characteristics of a “model” small-angle grain boundary in n-type direct silicon bonded wafer.
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| Title: | Effect of Au contamination on the electrical characteristics of a “model” small-angle grain boundary in n-type direct silicon bonded wafer. |
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| Authors: | Yu, X., Li, X., Fan, R. |
| Source: | Journal of Applied Physics; Oct2010, Vol. 108 Issue 4, p053719-1-053719-6, 6p |
| Database: | Applied Science & Technology Source |
| ISSN: | 00218979 |
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| DOI: | 10.1063/1.3471817 |
