APA (7th ed.) Citation

V, D. (2010). Applied's new InVia lays it on thick for 3D IC packaging. Solid State Technology, 53(5), 8.

Chicago Style (17th ed.) Citation

V, D. "Applied's New InVia Lays It on Thick for 3D IC Packaging." Solid State Technology 53, no. 5 (2010): 8.

MLA (9th ed.) Citation

V, D. "Applied's New InVia Lays It on Thick for 3D IC Packaging." Solid State Technology, vol. 53, no. 5, 2010, p. 8.