Applied's new InVia lays it on thick for 3D IC packaging.
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| Title: | Applied's new InVia lays it on thick for 3D IC packaging. |
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| Authors: | D. V. |
| Source: | Solid State Technology; May2010, Vol. 53 Issue 5, p8-8, 1/3p |
| Database: | Applied Science & Technology Source |
| ISSN: | 0038111X |
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