A Method to Leverage Pre-Silicon Collateral and Analysis for Post-Silicon Testing and Validation.

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Title: A Method to Leverage Pre-Silicon Collateral and Analysis for Post-Silicon Testing and Validation.
Authors: Miller, Gary1, Bhattarai, Bandana1, Yu-Chin Hsu2, Dutt, Jay2, Xi Chen2, Bakewell, George2
Source: DAC: Annual ACM/IEEE Design Automation Conference; Jun2011, p575-578, 4p, 1 Diagram, 2 Charts
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 65316318
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PubType: Conference
PubTypeId: conference
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PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=65316318
RecordInfo BibRecord:
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    Languages:
      – Code: eng
        Text: English
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      Pagination:
        PageCount: 4
        StartPage: 575
    Titles:
      – TitleFull: A Method to Leverage Pre-Silicon Collateral and Analysis for Post-Silicon Testing and Validation.
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            NameFull: Miller, Gary
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            NameFull: Bhattarai, Bandana
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            NameFull: Yu-Chin Hsu
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            NameFull: Dutt, Jay
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            NameFull: Xi Chen
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            NameFull: Bakewell, George
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            – D: 01
              M: 06
              Text: Jun2011
              Type: published
              Y: 2011
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            – Type: issn-print
              Value: 0738100X
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            – TitleFull: DAC: Annual ACM/IEEE Design Automation Conference
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