APA (7th ed.) Citation

Lin, C., Wang, C., Hung, M., Liu, T., & Yew, T. (2013). Low Resistivity Tin-Doped Copper Nanowires. IEEE Electron Device Letters, 34(4), 529. https://doi.org/10.1109/LED.2013.2246133

Chicago Style (17th ed.) Citation

Lin, Ching-Yen, Chiu-Yen Wang, Min-Hsiu Hung, Tzu-Ling Liu, and Tri-Rung Yew. "Low Resistivity Tin-Doped Copper Nanowires." IEEE Electron Device Letters 34, no. 4 (2013): 529. https://doi.org/10.1109/LED.2013.2246133.

MLA (9th ed.) Citation

Lin, Ching-Yen, et al. "Low Resistivity Tin-Doped Copper Nanowires." IEEE Electron Device Letters, vol. 34, no. 4, 2013, p. 529, https://doi.org/10.1109/LED.2013.2246133.