Barrierless Cu–Ni–Nb thin films on silicon with high thermal stability and low electrical resistivity.
Saved in:
| Title: | Barrierless Cu–Ni–Nb thin films on silicon with high thermal stability and low electrical resistivity. |
|---|---|
| Authors: | Li, Xiao Na1, Zhao, Li Rong1, Li, Zhen2, Liu, Li Jun1, Bao, Cui Min3, Chu, Jinn P.4, Dong, Chuang1 |
| Source: | Journal of Materials Research; Dec2013, Vol. 28 Issue 24, p3367-3373, 7p |
| Database: | Applied Science & Technology Source |
| FullText | Text: Availability: 0 |
|---|---|
| Header | DbId: aci DbLabel: Applied Science & Technology Source An: 93308037 AccessLevel: 2 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
| IllustrationInfo | |
| Items | – Name: Title Label: Title Group: Ti Data: Barrierless Cu–Ni–Nb thin films on silicon with high thermal stability and low electrical resistivity. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AU" term="%22Li%2C+Xiao+Na%22">Li, Xiao Na</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Zhao%2C+Li+Rong%22">Zhao, Li Rong</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Li%2C+Zhen%22">Li, Zhen</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Liu%2C+Li+Jun%22">Liu, Li Jun</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Bao%2C+Cui+Min%22">Bao, Cui Min</searchLink><relatesTo>3</relatesTo><br /><searchLink fieldCode="AU" term="%22Chu%2C+Jinn+P%2E%22">Chu, Jinn P.</searchLink><relatesTo>4</relatesTo><br /><searchLink fieldCode="AU" term="%22Dong%2C+Chuang%22">Dong, Chuang</searchLink><relatesTo>1</relatesTo> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Research%22">Journal of Materials Research</searchLink>; Dec2013, Vol. 28 Issue 24, p3367-3373, 7p |
| PLink | https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=93308037 |
| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1557/jmr.2013.355 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 7 StartPage: 3367 Titles: – TitleFull: Barrierless Cu–Ni–Nb thin films on silicon with high thermal stability and low electrical resistivity. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Li, Xiao Na – PersonEntity: Name: NameFull: Zhao, Li Rong – PersonEntity: Name: NameFull: Li, Zhen – PersonEntity: Name: NameFull: Liu, Li Jun – PersonEntity: Name: NameFull: Bao, Cui Min – PersonEntity: Name: NameFull: Chu, Jinn P. – PersonEntity: Name: NameFull: Dong, Chuang IsPartOfRelationships: – BibEntity: Dates: – D: 28 M: 12 Text: Dec2013 Type: published Y: 2013 Identifiers: – Type: issn-print Value: 08842914 Numbering: – Type: volume Value: 28 – Type: issue Value: 24 Titles: – TitleFull: Journal of Materials Research Type: main |
| ResultId | 1 |