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Dynamic Self-Repair Architectures for Defective Through-silicon Vias.

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Title: Dynamic Self-Repair Architectures for Defective Through-silicon Vias.
Authors: Joon-Sung Yang1, js.yang@skku.edu, Tae Hee Han1, than@skku.edu, Kobla, Darshan2, darshan.kobla@intel.com, Ju, Edward L.2, edward.l.ju@intel.com
Source: ETRI Journal; Apr2014, Vol. 36 Issue 2, p301-308, 8p
Database: Applied Science & Technology Source
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PubType: Academic Journal
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        Value: 10.4218/etrij.14.0113.0578
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        Text: English
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