Issa, T. T., Jasim, F. N., Mohammed, H. J., & Abbas, Z. K. (2017). Improvement of the Microstructure of Sn -- Bi Lead Free Solder Alloy. AIP Conference Proceedings, 1809(1), 1. https://doi.org/10.1063/1.4975439
Chicago Style (17th ed.) CitationIssa, T. T., F. N. Jasim, H. J. Mohammed, and Z. K. Abbas. "Improvement of the Microstructure of Sn -- Bi Lead Free Solder Alloy." AIP Conference Proceedings 1809, no. 1 (2017): 1. https://doi.org/10.1063/1.4975439.
MLA (9th ed.) CitationIssa, T. T., et al. "Improvement of the Microstructure of Sn -- Bi Lead Free Solder Alloy." AIP Conference Proceedings, vol. 1809, no. 1, 2017, p. 1, https://doi.org/10.1063/1.4975439.
Warning: These citations may not always be 100% accurate.