Improvement of the Microstructure of Sn -- Bi Lead Free Solder Alloy.

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Title: Improvement of the Microstructure of Sn -- Bi Lead Free Solder Alloy.
Authors: Issa, T. T.1 alazbrh@yahoo.com, Jasim, F. N.2, Mohammed, H. J.2, Abbas, Z. K.2
Source: AIP Conference Proceedings. 2017, Vol. 1809 Issue 1, p1-5. 5p. 3 Black and White Photographs, 3 Graphs.
Database: Academic Search Ultimate
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Header DbId: asn
DbLabel: Academic Search Ultimate
An: 121481605
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PubType: Conference
PubTypeId: conference
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  Data: <searchLink fieldCode="JN" term="%22AIP+Conference+Proceedings%22">AIP Conference Proceedings</searchLink>. 2017, Vol. 1809 Issue 1, p1-5. 5p. 3 Black and White Photographs, 3 Graphs.
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RecordInfo BibRecord:
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        Value: 10.1063/1.4975439
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      – Code: eng
        Text: English
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        PageCount: 5
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      – TitleFull: Improvement of the Microstructure of Sn -- Bi Lead Free Solder Alloy.
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            NameFull: Jasim, F. N.
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            NameFull: Mohammed, H. J.
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              Value: 1809
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