Die-Attach Technologies for Ultraviolet LED Multichip Module Based on Ceramic Substrate. - Burkhardt, T.; Hornaff, M.; Acker, A.; Peschel, T.; Beckert, E.; Suphan, K.-H.; Mensel, K.; Jirak, S.; Eberhardt, R.; Tünnermann, A. (Journal of Microelectronic & Electronic Packaging, 2012)