Residual stress prediction in ultrasonic vibration–assisted milling.

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Bibliographic Details
Title: Residual stress prediction in ultrasonic vibration–assisted milling.
Authors: Feng, Yixuan1 (AUTHOR) yfeng82@gatech.edu, Hsu, Fu-Chuan2 (AUTHOR) fchsu@mail.mirdc.org.tw, Lu, Yu-Ting2 (AUTHOR) lyting@mail.mirdc.org.tw, Lin, Yu-Fu2 (AUTHOR) yufulin@mail.mirdc.org.tw, Lin, Chorng-Tyan2 (AUTHOR) chontyan@mail.mirdc.org.tw, Lin, Chiu-Feng2 (AUTHOR) chiufeng@mail.mirdc.org.tw, Lu, Ying-Cheng2 (AUTHOR) ycl@mail.mirdc.org.tw, Liang, Steven Y.1 (AUTHOR) steven.liang@me.gatech.edu
Source: International Journal of Advanced Manufacturing Technology. Oct2019, Vol. 104 Issue 5-8, p2579-2592. 14p.
Database: Academic Search Ultimate
Description
ISSN:02683768
DOI:10.1007/s00170-019-04109-y